Accuracy: The difference between the measurement result and the target value.
Additive Process: A method of making PCB conductive traces by selectively depositing conductive materials (copper, tin, etc.) on the plies.
Adhesion: Similar to the attraction between molecules.
Aerosol: A liquid or gas particle that is small enough to be airborne.
Angle of attack: The angle between the screen print surface and the screen print surface.
Anisotropic adhesive: A conductive substance whose particles pass current only in the Z-axis direction.
Annular ring: A conductive material around the borehole.
Application specific integrated circuit: A circuit that is custom made for a specific purpose.
Array: A set of elements, such as: solder balls, arranged in rows and columns.
Artwork: A conductive wiring diagram of a PCB used to produce a photo original, which can be made in any ratio, but is typically 3:1 or 4:1.
Automated test equipment: In order to evaluate performance levels, equipment designed for automatic analysis or static parameters is also used for fault isolation.
Automatic optical inspection: On an automated system, use a camera to inspect a model or object.
B
Ball grid array: A form of packaging for an integrated circuit whose input and output points are solder balls arranged in a grid pattern on the underside of the component.
Blind via: An electrically conductive connection between the outer and inner layers of the PCB that does not continue to the other side of the board.
Bond lift-off: A failure to separate solder pins from the pad surface (board substrate).
Bonding agent: A glue that bonds a single layer to form a multilayer board.
Bridge: A solder that connects two conductors that should be electrically connected to each other, causing a short circuit.
Buried via: An electrically conductive connection between two or more inner layers of a PCB (ie, invisible from the outer layer).
C
CAD/CAM system: Computer-aided design uses specialized software tools to design printed circuit structures; computer-aided manufacturing converts this design into actual products. These systems include large-scale memory for data processing and storage, input for design creation, and output device for converting stored information into graphics and reports. Capillary action: Bringing molten solder against gravity A natural phenomenon in which solid surfaces flow close together.
Chip on board: A hybrid technology that uses chip components that are glued face up, traditionally connected to the base layer of the board by flying leads.
Circuit tester: A method of testing a PCB during mass production. Includes: needle bed, component lead footprints, pilot probes, internal traces, loading plates, empty plates, and component testing.
Cladding: A thin layer of metal foil bonded to the board layer to form PCB conductive traces.
Coefficient of the thermal expansion: When the surface temperature of the material increases, the measured mass per unit of temperature expands in parts per million (ppm).
Cold cleaning: An organic dissolution process in which liquid contact completes the residue removal after soldering.
Cold solder joint: A solder joint that reflects insufficient wetting. It is characterized by a grayish and porous appearance due to insufficient heating or improper cleaning.
Component density: The number of components on the PCB divided by the area of ​​the board.
Conductive epoxy: A polymeric material that passes an electric current by adding metal particles, usually silver.
Conductive ink: A glue used on thick film materials to form a PCB conductive wiring pattern.
Conformal coating: A thin protective coating applied to PCBs that conform to the assembled shape.
Copper foil: A thin, continuous metal foil deposited on the base layer of a circuit board as an electrical conductor of a PCB. It is easy to adhere to the insulating layer, accepts a printed protective layer, and forms a circuit pattern after etching. Copper mirror test: A flux corrosion test in which a vacuum deposited film is used on a glass plate.
Cure: A change in the physical properties of a material, either by chemical reaction or by a pressure/pressureless reaction to heat.
Cycle rate: A component patch noun used to measure the speed of a machine from picking, positioning, and returning, also known as test speed.
D
Data recorder: A device that measures and collects temperature from a thermocouple attached to a PCB at specific time intervals.
Defect: A component or circuit unit that deviates from a normally accepted feature.
Delamination: separation of the plies and separation between the plies and the conductive cover.
Desoldering: Disassemble the welding components for repair or replacement, including: suction with tin, vacuum (solder pipette) and hot drawing.
Dewetting: The process of covering and retracting the molten solder, leaving an irregular residue.
DFM (design for manufacturing): The method of producing products in the most efficient way, taking into account time, cost and available resources.
Dispersant: A chemical that is added to water to increase its ability to degranulate. Documentation: Information about assembly, explaining basic design concepts, types and quantities of components and materials, specialized manufacturing instructions, and the latest version. Three types are used: prototypes and a small number of runs, standard production lines and/or production quantities, and government contracts that specify actual graphics.
Downtime: The time at which a device does not produce a product due to maintenance or failure.
Durometer: Measures the rubber or plastic hardness of the blade.
E
Environmental test: A test or series of tests used to determine the overall external impact on the structural, mechanical, and functional integrity of a given component package or assembly.
Eutectic solders: Two or more metal alloys with the lowest melting point. When heated, the eutectic alloy changes directly from solid to liquid without going through the plastic phase.
F
Fabrication(): The empty board manufacturing process prior to assembly after design. The individual processes include lamination, metal addition/subtraction, drilling, plating, routing, and cleaning.
Fiducial: A special mark integrated with a circuit pattern for machine vision to find the direction and position of the wiring pattern.
Fillet: A connection formed by solder between a pad and a component lead. That is, solder joints.
Fine-pitch technology: The surface of the surface mount component package is spaced 0.025" (0.635mm) or less.
Fixture: A device that connects a PCB to the center of the processing machine.
Flip chip: A leadless structure that typically contains circuit elements. It is designed to be electrically and mechanically connected to the circuit by a suitable number of solder balls (covered by a conductive adhesive) on its face.
Full liquidus temperature: The temperature level at which the solder reaches its maximum liquid state, which is best for good wetting.
Functional test: Simulates the expected operating environment and tests the entire assembled electrical appliance.
G
Golden boy: A component or circuit assembly that has been tested and known to function to specification and used to test other units by comparison.
H
Halides: Compounds containing fluorine, chlorine, bromine, iodine or hydrazine. It is the catalyst part of the flux and must be removed due to its corrosive nature.
Hard water: Water contains calcium carbonate and other ions that may accumulate on the inner surface of clean equipment and cause blockages.
Hardener: A chemical added to a resin to prematurely cure, ie, a curing agent.
I
In-circuit test: A component-by-component test to verify the placement and orientation of components.
J
Just-in-time (JIT is just on time): Minimize inventory by supplying materials and components directly to the production line before putting it into production.
L
Lead configuration: A conductor that extends from a component and acts as both a mechanical and electrical connection.
Line certification: Confirm that the production line is in a controlled sequence and can produce a reliable PCB as required.
M
Machine vision: One or more cameras used to help find the center of the component or improve the component placement accuracy of the system.
Mean time between failure: The average statistical time interval at which a possible operational unit failure is expected, usually calculated on an hourly basis, and the results should indicate actual, projected, or calculated.
N
Nonwetting: A condition in which solder does not adhere to a metal surface. Due to the contamination of the surface to be welded, the characteristic of non-wetting is the bareness of the visible base metal.
Additive Process: A method of making PCB conductive traces by selectively depositing conductive materials (copper, tin, etc.) on the plies.
Adhesion: Similar to the attraction between molecules.
Aerosol: A liquid or gas particle that is small enough to be airborne.
Angle of attack: The angle between the screen print surface and the screen print surface.
Anisotropic adhesive: A conductive substance whose particles pass current only in the Z-axis direction.
Annular ring: A conductive material around the borehole.
Application specific integrated circuit: A circuit that is custom made for a specific purpose.
Array: A set of elements, such as: solder balls, arranged in rows and columns.
Artwork: A conductive wiring diagram of a PCB used to produce a photo original, which can be made in any ratio, but is typically 3:1 or 4:1.
Automated test equipment: In order to evaluate performance levels, equipment designed for automatic analysis or static parameters is also used for fault isolation.
Automatic optical inspection: On an automated system, use a camera to inspect a model or object.
B
Ball grid array: A form of packaging for an integrated circuit whose input and output points are solder balls arranged in a grid pattern on the underside of the component.
Blind via: An electrically conductive connection between the outer and inner layers of the PCB that does not continue to the other side of the board.
Bond lift-off: A failure to separate solder pins from the pad surface (board substrate).
Bonding agent: A glue that bonds a single layer to form a multilayer board.
Bridge: A solder that connects two conductors that should be electrically connected to each other, causing a short circuit.
Buried via: An electrically conductive connection between two or more inner layers of a PCB (ie, invisible from the outer layer).
C
CAD/CAM system: Computer-aided design uses specialized software tools to design printed circuit structures; computer-aided manufacturing converts this design into actual products. These systems include large-scale memory for data processing and storage, input for design creation, and output device for converting stored information into graphics and reports. Capillary action: Bringing molten solder against gravity A natural phenomenon in which solid surfaces flow close together.
Chip on board: A hybrid technology that uses chip components that are glued face up, traditionally connected to the base layer of the board by flying leads.
Circuit tester: A method of testing a PCB during mass production. Includes: needle bed, component lead footprints, pilot probes, internal traces, loading plates, empty plates, and component testing.
Cladding: A thin layer of metal foil bonded to the board layer to form PCB conductive traces.
Coefficient of the thermal expansion: When the surface temperature of the material increases, the measured mass per unit of temperature expands in parts per million (ppm).
Cold cleaning: An organic dissolution process in which liquid contact completes the residue removal after soldering.
Cold solder joint: A solder joint that reflects insufficient wetting. It is characterized by a grayish and porous appearance due to insufficient heating or improper cleaning.
Component density: The number of components on the PCB divided by the area of ​​the board.
Conductive epoxy: A polymeric material that passes an electric current by adding metal particles, usually silver.
Conductive ink: A glue used on thick film materials to form a PCB conductive wiring pattern.
Conformal coating: A thin protective coating applied to PCBs that conform to the assembled shape.
Copper foil: A thin, continuous metal foil deposited on the base layer of a circuit board as an electrical conductor of a PCB. It is easy to adhere to the insulating layer, accepts a printed protective layer, and forms a circuit pattern after etching. Copper mirror test: A flux corrosion test in which a vacuum deposited film is used on a glass plate.
Cure: A change in the physical properties of a material, either by chemical reaction or by a pressure/pressureless reaction to heat.
Cycle rate: A component patch noun used to measure the speed of a machine from picking, positioning, and returning, also known as test speed.
D
Data recorder: A device that measures and collects temperature from a thermocouple attached to a PCB at specific time intervals.
Defect: A component or circuit unit that deviates from a normally accepted feature.
Delamination: separation of the plies and separation between the plies and the conductive cover.
Desoldering: Disassemble the welding components for repair or replacement, including: suction with tin, vacuum (solder pipette) and hot drawing.
Dewetting: The process of covering and retracting the molten solder, leaving an irregular residue.
DFM (design for manufacturing): The method of producing products in the most efficient way, taking into account time, cost and available resources.
Dispersant: A chemical that is added to water to increase its ability to degranulate. Documentation: Information about assembly, explaining basic design concepts, types and quantities of components and materials, specialized manufacturing instructions, and the latest version. Three types are used: prototypes and a small number of runs, standard production lines and/or production quantities, and government contracts that specify actual graphics.
Downtime: The time at which a device does not produce a product due to maintenance or failure.
Durometer: Measures the rubber or plastic hardness of the blade.
E
Environmental test: A test or series of tests used to determine the overall external impact on the structural, mechanical, and functional integrity of a given component package or assembly.
Eutectic solders: Two or more metal alloys with the lowest melting point. When heated, the eutectic alloy changes directly from solid to liquid without going through the plastic phase.
F
Fabrication(): The empty board manufacturing process prior to assembly after design. The individual processes include lamination, metal addition/subtraction, drilling, plating, routing, and cleaning.
Fiducial: A special mark integrated with a circuit pattern for machine vision to find the direction and position of the wiring pattern.
Fillet: A connection formed by solder between a pad and a component lead. That is, solder joints.
Fine-pitch technology: The surface of the surface mount component package is spaced 0.025" (0.635mm) or less.
Fixture: A device that connects a PCB to the center of the processing machine.
Flip chip: A leadless structure that typically contains circuit elements. It is designed to be electrically and mechanically connected to the circuit by a suitable number of solder balls (covered by a conductive adhesive) on its face.
Full liquidus temperature: The temperature level at which the solder reaches its maximum liquid state, which is best for good wetting.
Functional test: Simulates the expected operating environment and tests the entire assembled electrical appliance.
G
Golden boy: A component or circuit assembly that has been tested and known to function to specification and used to test other units by comparison.
H
Halides: Compounds containing fluorine, chlorine, bromine, iodine or hydrazine. It is the catalyst part of the flux and must be removed due to its corrosive nature.
Hard water: Water contains calcium carbonate and other ions that may accumulate on the inner surface of clean equipment and cause blockages.
Hardener: A chemical added to a resin to prematurely cure, ie, a curing agent.
I
In-circuit test: A component-by-component test to verify the placement and orientation of components.
J
Just-in-time (JIT is just on time): Minimize inventory by supplying materials and components directly to the production line before putting it into production.
L
Lead configuration: A conductor that extends from a component and acts as both a mechanical and electrical connection.
Line certification: Confirm that the production line is in a controlled sequence and can produce a reliable PCB as required.
M
Machine vision: One or more cameras used to help find the center of the component or improve the component placement accuracy of the system.
Mean time between failure: The average statistical time interval at which a possible operational unit failure is expected, usually calculated on an hourly basis, and the results should indicate actual, projected, or calculated.
N
Nonwetting: A condition in which solder does not adhere to a metal surface. Due to the contamination of the surface to be welded, the characteristic of non-wetting is the bareness of the visible base metal.
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